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Yuliang Optoelectronic > News > SMD LEDs Knowledge > SMD led instruction manual

SMD led instruction manual

Thank you for using the SMD led series products of Shenzhen Yuliang Optoelectronics Technology Co., Ltd. In order to enhance your understanding of our company's product features, to facilitate you to master its characteristics during use, to minimize or avoid the cause of human factors Necessary product damage or performance mismatch. Hereby explain.

Material confirmation
Is the LED BIN rating of the material matched? For example: voltage CIE BIN brightness and other parameters are the same level, the same level should be used together. Whether the positive and negative polarities meet the requirements, whether the different foot positions meet the requirements. If the same level of LED is not applied to the same item, its applicability should be evaluated first. (If the different voltage BINs are used together, the brightness may be different, and different CIE BINs may use the luminescent colors together may be different).

2. Package and storage: Avoid moisture entering the inside of the LED before opening the package. It is recommended that the SMD series of LEDs be stored in a desiccant drying cabinet. Storage environment temperature range 5-30 degrees, humidity does not exceed 50%.
3. Preventive measures after unpacking Take the entire volume of dehumidification as much as possible after unpacking
Dehumidification conditions: baking at 70 degrees for 4-12 hours. The dehumidified material should be used as soon as possible (within 24 hours). Remaining material should be sealed or placed in an environment with 10-40 degrees humidity and no more than 30% humidity.
4. Operational notes
This product can only be rewelded at most twice, and after the first reflow, it must be cooled to room temperature for the second reflow. It is recommended that the reflow temperature range is 200-240 degrees. During the operation process, the material can not be taken directly by hand. There is sweat on the hand, and the sweat has optical contamination on the surface of the silica gel, which affects the light output. In addition, the silica gel is relatively soft, and hand squeezing will cause the dead lamp to be broken.
It is not recommended to mount LEDs on a bent circuit board. Avoid rapid cooling during soldering. Avoid any kind of mechanical force or excessive vibration during LED solder cooling. After soldering, do not bend the circuit board. During rework or single-material work, the surface of the colloid cannot be squeezed with tweezers. Because silica gel is relatively soft, squeezing the colloid with tweezers can lead to wire breakage, which can damage the wafer and cause it to die.
In batch operations, the suction nozzle smaller than the inner diameter of the product will cause the nozzle to punch the silicone, causing the gold wire to break and the wafer to be pressurized and die.
It is not advisable to perform soldering for the LED that has been soldered. If it is unavoidable, double-head soldering iron should be used. However, it is necessary to confirm in advance whether the LED feature will be damaged after the repair.
5. Electrostatic Protection LED is an electrostatic sensitive electronic device. Various measures should be taken to avoid static electricity.
For example: Wear an electrostatic ring during use. All devices, equipment and instruments should be grounded. It is recommended to test the assembled LED product to check if the LED is damaged by static electricity.
6. Clean cleaning
It is recommended that isopropyl alcohol be used to clean the LEDs. If using other solvents for cleaning, make sure that the solvent does not affect the epoxy, silicone, silicone, or stent silver layers. Ultrasonic cleaning is not recommended to prevent damage to the LED. If unavoidable, please perform a pre-test in advance to confirm if there is any adverse effect on the LED or potential hazards.
7. Other considerations
Long-term exposure of the LED to sunlight or occasional exposure to ultraviolet light may cause yellowing of the gel. In order to ensure the photoelectric performance of the LED, keep the surface of the LED lighting area clean, avoid fingerprints or other foreign objects.
When designing the circuit, reverse voltage or excessive current in the switching process should be prevented from impacting the LED instantaneously. During use, avoid sharp tools such as tweezers touching the silicone gel section.

Shenzhen Yuliang Optoelectronics Technology Co., Ltd. has 10 years of experience in low power led packaging, led packaging independent laboratory, can achieve high and low temperature thermal shock test, anti-vulcanization test, moisture test, constant temperature and humidity, LM-80 standard 6000H continuous light Failure testing, etc., the product has obtained more than 30 patent applications.